Intelligent Connectivity Platform

The rapid growth in AI and accelerated pace of AI platform design cycles is driving the need for exponential compute at cloud-scale, and purpose-built connectivity solutions are required to unlock the full potential of cloud and AI infrastructure.

Driven by the growth of AI workloads at scale, Astera Labs devised the innovative concept of the Intelligent Connectivity Platform, allowing holistic design with monitoring and tracking capabilities for long-term health and performance of connectivity infrastructure.

Astera Labs’ Intelligent Connectivity Platform is comprised of:

  1. High-speed connectivity integrated circuits (ICs), modules, and boards
  2. COSMOS: Connectivity System Management and Optimization Software

Differentiators:

The Intelligent Connectivity Platform provides hyperscaler customers with the ability to deploy and operate high-performance AI and cloud infrastructure, addressing an increasingly diverse set of requirements.

  • Patented software-defined IC architecture with distributed microcontrollers and sensors delivers functionality, diagnostics and telemetry
  • Software and hardware combination delivers a smart connectivity backbone that is scalable and customizable
  • Easily extensible to integrate new features and solutions
  • Robust reliability, security, quality-of-service, and software management capabilities facilitate deployment at scale
  • Real-time link and device monitoring for fleet health management and improved user experience

Key Customer Benefits

Superior Performance

Gain high bandwidth and low latency connectivity at cloud-scale, enabling the next generation of cloud infrastructure critical for data-centric AI workloads.  

Accelerated Time-to-Market

Leverage pre-validated and interoperable solutions and our robust partner ecosystem for seamless system integration and faster, more reliable deployment.

Lower Total Cost of Ownership

Increase utilization of expensive GPUs and AI accelerators, unlock scalable memory expansion, and provide greater system uptime for hyperscalers.

Breaking the 100 GB/s Barrier: Astera Labs and Micron Demonstrate Production-Ready PCIe 6 Storage Performance at FMS 2025

The future of AI infrastructure arrived at the Future of Memory and Storage (FMS) 2025 conference, where Astera Labs and Micron achieved a groundbreaking milestone: over 100 GB/s of sustained throughput using production-ready PCIe 6 technology. This industry-first demonstration represents a transformative advancement in AI storage performance, featuring four Micron 9650 PCIe Gen6 SSDs and… Read more

Astera Labs at FMS 2025: Accelerating Storage and Memory Innovation in the AI Infrastructure 2.0 Era

As AI models push computational boundaries with breakthrough reasoning capabilities, storage and memory must also evolve to optimize AI Infrastructure 2.0. From training massive models to enabling real-time inference, every part of the AI workflow relies on seamless connectivity between diverse storage and memory technologies.Join Astera Labs at the Future of Memory and Storage Summit… Read more

Astera Labs at OCP APAC Summit: Advancing Open AI Infrastructure 2.0 Through Rack-Scale Connectivity

As AI training clusters scale to 200,000+ GPUs, traditional server architectures require a fundamental paradigm shift to handle this unprecedented scale. Join Astera Labs at the OCP APAC Summit, August 5-6 in Taipei, as we put a spotlight on the transition to AI Infrastructure 2.0—where the rack is replacing the server as the new unit of compute.This transformation isn’t just evolutionary—it’s… Read more

Astera Labs Announces Third Quarter 2025 Financial Conference Participation

SAN JOSE, CA, U.S. – Aug. 20, 2025 – Astera Labs, Inc. (Nasdaq: ALAB), a leader in semiconductor-based connectivity solutions for rack-scale AI infrastructure, today announced its participation in financial conferences for the third quarter 2025.Deutsche Bank 2025 Technology Conference on Aug. 28, 2025. Astera Labs’ presentation is scheduled for 12:30 pm PT.Citi’s 2025 Global… Read more

Astera Labs Announces Financial Results for the Second Quarter of Fiscal Year 2025

Record quarterly revenue of $191.9 million, up 20% QoQ and 150% YoY, and record operating cash flow generation of $135.4 millionIndustry leading PCIe 6 connectivity portfolio ramping in volume on customized rack-scale AI systemsScorpio Fabric Switch design wins expand across multiple new customers and applicationsSAN JOSE, CA, U.S. – August 5, 2025 – Astera Labs, Inc. (Nasdaq:… Read more

Astera Labs Opens New Global Headquarters in San Jose to Accelerate AI Infrastructure Innovation

900-employee campus powers Astera Labs’ mission to usher in the rack-scale computing eraSAN JOSE, Calif.– July 18, 2025 – Astera Labs, Inc. (Nasdaq: ALAB), a provider of semiconductor connectivity solutions for AI and cloud infrastructure, today announced the opening of its new corporate headquarters in San Jose, California. Designed to accommodate up to 900 employees, the new… Read more

Astera Labs Announces Conference Call to Review Second Quarter 2025 Financial Results

SAN JOSE, Calif., July 08, 2025 — Astera Labs, Inc. (Nasdaq: ALAB), a global leader in semiconductor-based connectivity solutions for AI and cloud infrastructure, today announced that it will release its financial results for the second quarter 2025 after the close of market on Tuesday, Aug. 5, 2025. Astera Labs will host a corresponding conference call at 1:30 p.m. Pacific Time, 4:30… Read more

Rack-Scale AI Connectivity with UALink

When the ecosystem works together, innovation happens faster. As a founding board member of the UALink™ Consortium, learn how Astera Labs – in collaboration with XPU partners – plans to deliver a complete portfolio of UALink products to support scale-up AI infrastructure. Read more

Leading the AI Infrastructure 2.0 Era

AI has outgrown the server. The rack is now the unit of compute — a tightly integrated, AI-optimized system. Welcome to AI Infrastructure 2.0.Astera Labs’ co-founders share how the company is leading the transition to AI Infrastructure 2.0 with a complete portfolio of purpose-built silicon hardware and software solutions grounded in open standards. Read more

Accelerate AI with Real-World CXL Platforms

We collaborated with SMART Modular Technologies to showcase our Leo CXL™ Smart Memory Controller in a real-world setup that delivered up to 2TB of additional CXL memory with SMART CXL add-in cards.In the demo, Large Language Model inferencing tasks were run using FlexGen, achieving 5.5× higher throughput and 90% GPU utilization—demonstrating the efficiency gains CXL brings to AI workloads…. Read more