Join us at SC23. We will be demonstrating our Leo CXL Memory Connectivity Platform and Aries PCIe/CXL Smart Retimers. Contact us to schedule a meeting.

We are thrilled to join the OCP Global Summit again this year in San Jose. Schedule time to meet with our team: [email protected].

Join us at PCI-SIG DevCon Israel. Contact us to schedule a meeting.

We are excited to be joining on a journey of innovation, empowerment, and connection at the Grace Hopper Celebration this September 26-29 in Orlando! Meet with us to learn about opportunities to make an immediate impact at Astera Labs as we shape the future of connectivity for AI. Contact us…

Join us at the Storage Developer Conference this September 18-21 in Fremont! Sandeep Dattaprasad will join the CXL Consortium panel on #CXL: Advancing Coherent Connectivity on Sept. 21 at 9:10am. Get your questions answered on CXL architectures and the importance of delivering an interoperable ecosystem.  

We’re excited to join Intel Innovation this year. Reach out to us at [email protected] to schedule time to meet.

Join our Liang Liu at #Keysight World Tech Day 2023 in Shanghai on September 12 for a presentation on “#CXL Technology and Solutions.” Learn about our Leo Memory Connectivity Platform – the industry’s first silicon for CXL memory expansion and pooling that delivers up to 2TB more memory per #CPU.

It was a great week at Flash Memory Summit! With our partners, we won the Best of Show Award for Most Innovative Enterprise Business Application for our CXL demo on accelerating database performance. We also showed the industry’s first demonstration of CXL 2.0 RAS capabilities and demonstrated our Aries PCIe/CXL…

We’re excited to join this year’s PCI-SIG DevCon. Casey Morrison, Chief Product Officer, will present on “Design Considerations for PCIe 6.0 Retimers” on June 14 at 2:30pm PT. Schedule time to meet with our team: [email protected].

It was an exciting week at MemCon- an industry-first memory event focused on end users and systems! We felt the energy around CXL technology. If we missed you at the show, reach out to schedule some time with our team: [email protected].

We joined OIF and more than 30 global companies for the largest ever multi-vendor interoperability demonstration at OFC this year.  The demo covered four key areas: 400ZR optics, Co-Packaging architectures, Common Electrical I/O (CEI) architectures and Common Management Interface Specification (CMIS) implementations.

Join us in Dallas at SC22 to see our new CXL demo with the Leo Memory Connectivity Platform.