Astera Labs Joins the Optical Internetworking Forum (OIF) Interoperability Demo at OFC 2023

Astera Labs is hitting the road to join OIF in San Diego for OFC® – the Optical Fiber Communications Conference and Expo – taking place March 5-9 at the San Diego Convention Center.

We are proud to take part in OIF’s largest ever multi-vendor interoperability demonstration. More than 30 member companies are coming together to highlight four critical areas for next-generation optical technology: 400ZR optics, co-packaging architectures, Common Electrical I/O (CEI) architectures, and Common Management Interface Specification (CMIS) implementations.

Astera Labs will showcase compliance of our Taurus Ethernet Smart Cable Modules™ with a live demo of CMIS 5.0 in real-world Ciena, Juniper, and Cisco router/switch applications. CMIS provides an industry standard mechanism to initialize and manage optical and copper modules, while still providing the capability to supply custom functionality and diagnostics. This commonality makes integration into different host platforms easier for both the host and module vendors.

Confidently Deploy Taurus with proven CMIS 5.0. interoperability

The Taurus Smart Cable Module is a smart and active solution that removes rack-level Ethernet bottlenecks with Active Electrical Cables, overcoming reach, signal integrity and bandwidth utilization issues for up to 100G/Lane Ethernet connectivity for Switch-to-Switch and Switch-to-Server applications. Unlike other solutions, Taurus Ethernet Smart Cable Modules have a flexible paddle card design that supports multiple cable vendors as well as all-in-one firmware, enabling data center operators to have the most control over their switch, Network Interface Card (NIC), and Active Electrical Cable deployment configurations. With CMIS 5.0 interop baked in, Taurus simplifies server rack bring-up and ensures high reliability. Visit OIF Booth #5101 to see Taurus in action.

Get insight on standardized co-packaged optics solutions

Richard Ward, our Chief Technologist for Data Connectivity, will join other OIF experts as a panelist to discuss Enabling Next Generation Co-Packaging Solutions on March 9 from 12:15pm-1:15pm PT in Expo Theater II. Co-packaging is a hot-button topic – with OIF addressing the need for standardized co-packaged optics solutions that address the power constraints and increased bandwidth density needs of data centers. Don’t miss this important session!

Schedule a Meeting Today

Contact us at [email protected] to schedule a meeting with our experts at OFC. We hope to see you at the show!